Senior Packaging Engineer - Quantum


Location: Redmond, Washington

Job Type: Full time


Be brave, not perfect.
- Reshma Saujani

Microsoft’s Quantum research group is exploring ways to build a full-stack quantum computer and has become the world’s center of expertise on topological quantum computing. The research effort includes theoretical and experimental teams around the world, who have been designing and optimizing all aspects of the quantum computer, from topological qubit designs to cryogenic control and readout circuitry, to runtime software and quantum language compilers. Microsoft Quantum will change the world of computing and help solve some of humankind’s currently unsolvable problems. For more information about our team, visit


We are looking for a Senior Packaging Engineer with a focus on the development of assembly processes and materials to meet the unique requirements of quantum devices. Responsibility will include adapting standard packaging processes and materials to the unique requirements of quantum devices. You will be working with a diverse team of engineers and scientists on assembling and scaling complex quantum hardware devices. To be successful, you will actively work with our globally distributed team to invent and develop assembly processes and materials that enable the scaling of quantum devices. Specifically, your work will include:

  • Investigate the performance of package materials and structures under cryogenic temperatures and develop new materials or processes to enable quantum device performance.
  • Regularly interact with different teams to support the function and scaling of new quantum devices.
  • Work with internal and external component suppliers to support assembly of quantum devices.
  • Drive development of advanced packaging technologies to support the scaling of quantum hardware. May require management of external development programs.
  • Work in teams or independently as required.



  • Master’s or PhD in mechanical, electrical, or materials engineering, or other related fields.
  • 5+ years of experience with packaging of complex (optomechanical, MEMS, microwave, …) devices.
  • Demonstrated history of adapting or inventing materials and processes to solve packaging challenges in complex devices.
  • Ability to work in a team and effectively communicate to meet deadlines and deliver results.
  • Experience with industry standard packaging processes (wire bonding, die bonding, dispense, flip chip bonding, …).
  • Experience with preparing component specifications and sourcing vendor technical management.
  • Travel up to 25 % of the time.


  • Experience in cryogenic materials.
  • Experience in microwave device packaging.



Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form.

Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.

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