Job Overview

TE Connectivity’s R&D/Product Development Engineering Teams conceive new products and introduce them into practice. They are responsible for product development and qualification from market definition through production and release; assist in the capability of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication, and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation, including, but not limited to, Solid Models, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches, or notes and contribute to design modifications to facilitate manufacturing operation or product quality. Typical fields of expertise include materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical, and electronic components, products and their integration into systems.

Job Overview:
TE Connectivity’s R&D/Product Development Engineering Teams are responsible for driving new products from concept to HVM. From market definition through production and release; the teams assist in the qualification of suppliers for new products, define materials, and services for new or improved manufacturing processes; conduct feasibility studies and testing on new and modified designs; direct and support detailed design, testing, prototype fabrication, and manufacturing ramp. The Thermal Development Team within Development Engineering has responsibility for thermal design aspects and the performance of associated products. Additionally, the team is responsible for finding innovative solutions to thermal challenges in the high-speed interconnect industry. Through modeling and physical validation, those solutions are enabled by the more extensive TE manufacturing base to be brought to the global market.
Position Responsibilities:

• Innovate cooling solutions in the high-speed digital interconnect industry.
  
• Research and apply emerging technologies to new product development.
  
• Analyze electronics cooling problems through robust modeling methods.
  
• Address near-adjacent technical challenges such as:
  

o Manufacturability
o Tolerancing
o Structural Integrity
o Life Cycle
o Cost & Market Acceptance

• Help expand global BKM around simulation methods.
  
• Present data and ideas in a clear and impactful manner.
  
• Interface with engineering teams of various disciplines and external customers.

What your background should look like:

Qualifications:

• Bachelor’s Degree in related field required, Masters or PhD preferred.
  
• 5+ years of experience in the electronics cooling industry.
  
• 5+ years of thermal modeling with ANSYS Icepak and/or similar CFD tool.
  
• 3D CAD skills with ANSYS SpaceClaim or PTC Creo (ProE)
  
• Experience and knowledge with liquid and/or immersion cooling.
  
• Experience with mechanical structural analysis a plus.
  
• Self-motivated, efficient, ability to work with little or no supervision, and committed to a team approach.
  
• Strong interpersonal, organization, and project management skills.
  
• Ability to prioritize responsibilities in a fast-paced work environment.
  
• Experience and knowledge in the high-speed digital industry a plus.
  
• Experience in core processes such as stamping, molding, plating and assembly preferred.
  

Key Attributes Needed:

• Ability to understand and discuss technical engineering issues.
  
• Ability to read and understand drawings and specifications.
  
• Comfortable interfacing with and presenting to various disciplines.
  
• Attention to detail and accuracy.
  
• Ability to work on multiple concurrent projects.

Competencies